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CEVA Announces 32-bit, Dual-MAC TeakLite-III DSP Core By BDTI, 6/20/2007 Note: This article has been changed on 07/18/2007 from its original version. On May 31, CEVA Inc. announced CEVA-TeakLite-III, a new family of DSP cores. To meet the precision and throughput demands of its intended applications, which include high-end audio, 3G cellular, VoIP, and portable audio players, the TeakLite-III features support for both 32-bit and 16-bit fixed-point data, and increased MAC throughput relative to CEVA’s earlier TeakLite cores. (More)

MIPS Announces High-Performance Superscalar Core By BDTI, 6/20/2007 MIPS has introduced the MIPS 74K, a new, high-performance synthesizable general-purpose microprocessor core. The 74K targets demanding multimedia and networking applications, such as high-end video and WiMaX, and has already been shipped to lead customers. (More)

Jeff Bier’s Impulse Response – DSP Vendors Need Multi-Core Tools Strategy By BDTI, 6/20/2007 There’s been a lot of press lately about start-up companies offering multi-core DSP chips.  What’s less widely discussed is that large, established DSP chip vendors have been offering multi-core DSP chips for years.  These chips have been popular in “channelized” applications where workload partitioning is fairly straightforward. (More)

Case Study: Early Benchmarking Yields Better Products By BDTI, 6/20/2007 Chip and IP vendors typically utilize benchmarks for marketing purposes—specifically, to demonstrate the capabilities of their products to prospective customers. But such vendors are missing half the picture: during the design of a processor, subsystem, or chip, good benchmarks are invaluable for ensuring that the design is as good as it can be. (More)

Tips and Tricks for Debugging Audio By BDTI, 6/8/2007 This article explains how to set up an audio test rig, and how to design test audio signals. It also shows how to use test equipment including oscilloscopes, audio editing software, and your own ears. (More)